Patent · US Active

Method and apparatus for laser beam roughening of surfaces of substrates

US11364571B2 · kind B2 · utility

0Cited by

8References

23Claims

0Family size

Assignee

Gehring Technologies GmbH + Co. · DE

Inventors

Gerhard Flores · Esslingen am Neckar, DE
Martin Freitag · Munich, DE
Wolfram Lohse · Biberach an der Riß, DE

Key dates

Filing date	Feb 17, 2017
Grant date	Jun 21, 2022
Priority date	—
Expiry date	Jun 15, 2039

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB23K2101/35
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

The invention relates to a device for roughening cylinder bores using a beam tool and offering a very high level of process reliability even for a large quantity.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.