Recyclable release substrate

US11365516B2 · kind B2 · utility

Assignee

• MITSUBISHI HITEC PAPER EUROPE GMBH · DE

Inventors

• Dieter Becker · Neunburg vorm Wald, DE
• Nadia El-Karzazi · Bielefeld, DE
• Konstantinos Kalessios · Frankfurt, DE
• Jochen Schlegel · Heroldsberg, DE
• Nora Wilke · Flensburg, DE
• Claas Boxhammer · Herford, DE

Key dates

• Filing date: Dec 20, 2018
• Grant date: Jun 21, 2022
• Expiry date: Mar 30, 2039

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C09J2400/283
• WIPO field: Textile and paper machines
• WIPO sector: Mechanical engineering

Abstract

A release substrate includes: a carrier substrate having a front side and a reverse side opposite the front side, and a release layer disposed on the front side and/or reverse side of the carrier substrate. The release layer includes a polymeric binder and a wax based on a vegetable oil.