Sensor device
US11365990B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 25, 2018 |
| Grant date | Jun 21, 2022 |
| Priority date | — |
| Expiry date | Sep 25, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01P1/02
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A sensor device for detecting a physical variable. The sensor device includes a housing, a sensor module arranged in the housing, a potting compound which at least partially fills the housing and which encloses the sensor module, and at least one mounting element via which the sensor module is mounted to the housing. The sensor module includes a module board and at least one motion-sensitive sensor element which is arranged on the module board. The potting compound, in a cured state, has a hardness which is greater than a hardness of the at least one mounting element and less than a hardness of the housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.