Atomic layer deposition process for fabricating dielectric metasurfaces for wavelengths in the visible spectrum
US11366296B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Nov 23, 2016 |
| Grant date | Jun 21, 2022 |
| Priority date | — |
| Expiry date | Mar 10, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B1/02
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method of fabricating a visible spectrum optical component includes: providing a substrate; forming a resist layer over a surface of the substrate; patterning the resist layer to form a patterned resist layer defining openings exposing portions of the surface of the substrate; performing deposition to form a dielectric film over the patterned resist layer and over the exposed portions of the surface of the substrate, wherein a top surface of the dielectric film is above a top surface of the patterned resist layer; removing a top portion of the dielectric film to expose the top surface of the patterned resist layer and top surfaces of dielectric units within the openings of the patterned resist layer; and removing the patterned resist layer to retain the dielectric units over the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.