Patent · US Active

Atomic layer deposition process for fabricating dielectric metasurfaces for wavelengths in the visible spectrum

US11366296B2 · kind B2 · utility

8Cited by
4References
14Claims
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Key dates

Filing dateNov 23, 2016
Grant dateJun 21, 2022
Priority date
Expiry dateMar 10, 2037

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG02B1/02
  • WIPO fieldOptics
  • WIPO sectorInstruments

Abstract

A method of fabricating a visible spectrum optical component includes: providing a substrate; forming a resist layer over a surface of the substrate; patterning the resist layer to form a patterned resist layer defining openings exposing portions of the surface of the substrate; performing deposition to form a dielectric film over the patterned resist layer and over the exposed portions of the surface of the substrate, wherein a top surface of the dielectric film is above a top surface of the patterned resist layer; removing a top portion of the dielectric film to expose the top surface of the patterned resist layer and top surfaces of dielectric units within the openings of the patterned resist layer; and removing the patterned resist layer to retain the dielectric units over the substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.