Precision structured glass articles, integrated circuit packages, optical devices, microfluidic devices, and methods for making the same
US11367665B2 · kind B2 · utility
1Cited by
7References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 24, 2018 |
| Grant date | Jun 21, 2022 |
| Priority date | — |
| Expiry date | May 8, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15788
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The present disclosure relates to a reconstituted wafer- and/or panel-level package comprising a glass substrate having a plurality of cavities. Each cavity is configured to hold a single IC chip. The reconstituted wafer- and/or panel-level package can be used in a fan-out wafer or panel level packaging process. The glass substrate can include at least two layers having different photosensitivities with one layer being sufficiently photosensitive to be capable of being photomachined to form the cavities.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.