Electronic semiconductor component and method for producing an electronic semiconductor component
US11367691B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 8, 2019 |
| Grant date | Jun 21, 2022 |
| Priority date | — |
| Expiry date | Jul 8, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2223/54486
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic semiconductor component with a housing structure and a cavity introduced into the housing structure is specified. The cavity comprises a base surface. Furthermore, the electronic semiconductor component comprises an auxiliary layer arranged on the base surface of the cavity and a marking penetrating the auxiliary layer at least as far as the base surface of the cavity. The marking comprises an optical contrast that depends on both an optical property of the housing structure and an optical property of the auxiliary layer. Furthermore, a method for producing an electronic semiconductor component is given.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.