Integrated circuit backside metallization
US11367699B2 · kind B2 · utility
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19Claims
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Key dates
| Filing date | Sep 1, 2020 |
| Grant date | Jun 21, 2022 |
| Priority date | — |
| Expiry date | Sep 1, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for backside metallization includes inkjet printing a pattern of nanosilver conductive ink on a first surface of a silicon wafer. The silicon wafer includes a plurality of dies. The pattern includes a clearance area along a scribe line between the dies. A laser is focused, through a second surface of the wafer, at a point between the first surface of the silicon wafer and the second surface of the silicon wafer. The second surface is opposite the first surface. The dies are separated along the scribe line.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.