Electronic package, terminal and method for processing electronic package
US11367700B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 29, 2017 |
| Grant date | Jun 21, 2022 |
| Priority date | — |
| Expiry date | Jan 1, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device comprising a connecting plate and a circuit element is disclosed. The circuit element is electrically coupled to the connecting plate through a solder connection including a plurality of solder balls disposed between the circuit element and the connecting plate. An underfill layer is formed between the circuit element and the connecting plate and configured to provide bonding between the circuit element and the connecting plate. The solder connection includes a first solder area with a first solder ball density and a second solder area with a second solder ball density. The first solder ball density is less than the second solder ball density. The underfill layer includes a bonding material continuously disposed in the second solder area of the solder connection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.