High density and tool-less drive enclosure for a disk array
US11369031B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 7, 2020 |
| Grant date | Jun 21, 2022 |
| Priority date | — |
| Expiry date | Jul 24, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1427
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A disk array includes a drive enclosure and a pair of rails. The drive enclosure includes a tray with a first base leg and a second base leg spaced from the first base leg, where the tray facilitates receipt of a memory drive device at a space between the first and second base legs such that the drive locking pins engage with openings along surfaces of the memory drive device. A handle pivotally connects with the tray to facilitate rotational movement of the handle in relation to the tray. A pair of rails secure to a printed circuit board (PCB) of an electronic device, and the rails receive and retain portions of the tray and the handle when the tray is inserted between the rails of the pair.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.