Heat sink, heat sink arrangement and module for liquid immersion cooling
US11369040B2 · kind B2 · utility
3Cited by
10References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 22, 2021 |
| Grant date | Jun 21, 2022 |
| Priority date | — |
| Expiry date | Jun 22, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20272
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Devices are provided that include a device housing defining and a maximum dielectric cooling liquid level, and a dielectric cooling liquid outlet weir in the device housing from which dielectric cooling liquid exits the interior space. The cooling liquid outlet weir can set the level of the dielectric cooling liquid within the interior space and establish a volumetric rate of flow of the dielectric cooling liquid within the interior space that is needed for the cooling of heat-generating electronic components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.