Implantable flexible neural microelectrode comb, and preparation method and implantation method therefor
US11369302B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 6, 2017 |
| Grant date | Jun 28, 2022 |
| Priority date | — |
| Expiry date | Mar 17, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09681
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed are an implantable flexible neural microelectrode comb, and a preparation method and implantation method therefor. The flexible neural microelectrode comb is mainly composed of a flexible substrate layer (1), a flexible insulation layer (2), and a metal connection wire layer (3) arranged between the flexible substrate layer (1) and the flexible insulation layer (2); the flexible neural microelectrode comb comprises a filament structure (4), a mesh structure (5), a plane structure (6) and a bonding pad area (7) connected in sequence; electrode sites (8) are arranged on the filament structure (4); bonding pads are arranged on the bonding pad area (7); the metal connection wire layer (3) is composed of metal connection wires connecting the electrode sites (8) and the bonding pads; and the flexible insulation layer (2) is not arranged on the surfaces of the electrode sites (8) and the bonding pads. The prepared flexible neural microelectrode comb has a structure gradually changing from a filament to a mesh to a plane structure, thus improving mechanical stability during a deformation process. The mechanical properties of the implantable flexible neural microelectrode comb mat…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.