Fast-curing epoxy systems

US11370876B2 · kind B2 · utility

Assignee

• Evonik Operations GmbH · DE

Inventors

• Emmanouil Spyrou · Schermbeck, DE
• Dirk Fuchsmann · Haltern am See, DE
• Britta Kohlstruk · Gladbeck, DE
• Annette Sandkühler · Marl, DE

Key dates

• Filing date: May 10, 2019
• Grant date: Jun 28, 2022
• Expiry date: Jun 23, 2039

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C09J163/00
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

The present invention relates to a low-alkylphenol composition comprising a) at least one epoxy resin, b) at least one amine having at least two secondary amino groups that are both part of an organic ring system, and c) at least one salt of a strong Brønsted acid with a counterion selected from metal ions, metal-containing ions, phosphonium ions and ammonium ions, to processes for production thereof and to the use thereof.