Method for forming groove in hybrid optical device, and hybrid optical device
US11372159B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 20, 2019 |
| Grant date | Jun 28, 2022 |
| Priority date | — |
| Expiry date | Jul 18, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B2006/1208
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A groove having any length is manufactured in a quartz-based waveguide chip without limitation of a chip size. A marker indicating a planned cutting line extending from a connection end surface of a quartz-based waveguide chip in an in-chip plane direction is formed in advance by processing a core layer of the waveguide of the quartz-based waveguide chip, an irradiation position of laser light is aligned with a position of a starting point of the marker in a state where quartz-based waveguide chip is placed on a stage, and a groove is manufactured in the connection end surface of the quartz-based waveguide chip by moving the stage in the extending direction of the marker while irradiating the quartz-based waveguide chip with the laser light from an upper side.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.