System and method for a system-in-package using EMI shielding for capacitive touch sensing
US11372506B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 24, 2020 |
| Grant date | Jun 28, 2022 |
| Priority date | — |
| Expiry date | Nov 24, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03K2217/960765
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Systems, methods, and computer-readable media are disclosed for systems-in-packages that are encapsulated, at least partially, by a coating serving as electromagnetic interference (EMI) shielding, thereby isolating and otherwise protecting components in the systems-in-package from interference. The systems-in-packages may include one or more capacitive sensors in communication with a portion of the EMI shielding that serves as a sensing pad. In this manner, the system-in-package may benefit from EMI shielding and capacitive touch sensing capability without the complexity and increased cost of a separate capacitive touch sensor and sensing pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.