Generic physical layer providing a unified architecture for interfacing with an external memory device and methods of interfacing with an external memory device
US11373694B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 6, 2021 |
| Grant date | Jun 28, 2022 |
| Priority date | — |
| Expiry date | Feb 6, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11C8/06
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A generic physical layer providing a unified architecture for interfacing with an external memory device. The physical layer comprises a transmit data path for transmitting a parallel data to the external memory device and a receive data path for receiving a serial data from the external memory device. The generic physical layer is characterized by a receive enable logic for masking strobe of the serial data, wherein the transmit data path and the receive data path each comprising a FIFO circuit, a data rotator and an adjustable-delay logic for delay tuning and a per-bit-deskew for multi-lane support.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.