High efficiency die dicing and release
US11373908B2 · kind B2 · utility
1Cited by
84References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 16, 2020 |
| Grant date | Jun 28, 2022 |
| Priority date | — |
| Expiry date | Apr 16, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/49838
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of batch massively parallel die release of a die from a substrate enabling low cost mass production of with passive, system in package (SiP) or system-in-a-package, or systems-on-chip (SoC), filters and/or other devices from a glass substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.