System-in-package (SiP) with vertically oriented dielets
US11373977B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 15, 2020 |
| Grant date | Jun 28, 2022 |
| Priority date | — |
| Expiry date | Sep 15, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system-in-package (SiP) incorporating] is disclosed. In embodiments, the host die defines a substantially horizontal plane (e.g., via its active side). One or more vertical dielets are attached to, and interconnected with, the active side of the host die in a substantially vertical configuration (e.g., perpendicular to the host die). Due to the perpendicular orientation of the dielets, the SiP incorporates thermal spreaders in thermal contact with the active side of the host die as well as the inactive sides of the dielets, allowing for thermal dissipation from the host dies and dielets without the need for through silicon vias.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.