Semiconductor chip having a plurality of LED for image display
US11373978B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 4, 2018 |
| Grant date | Jun 28, 2022 |
| Priority date | — |
| Expiry date | Jun 5, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG09G2310/0297
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention concerns a display device including a transfer substrate (1010) including electric connection elements (L1, L2, C1, C2, P1, P2, P3, P4), and a plurality of semiconductor chips, wherein the transfer substrate (1010) includes an insulating plate, the electric connection elements of the substrate being formed by printing, on a surface of said plate, of a first conductive level, followed by an insulating level, followed by a second conductive level, the electric connection elements of the substrate including: a plurality of first conductive tracks (L1, L2) formed in the first conductive level; a plurality of second conductive tracks (C1, C2) formed in the second conductive level; and for each chip of the device, a plurality of electric connection areas (P1, P2, P3, P4) respectively connected to connection terminals of the chip, said areas being all formed in the second conductive level.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.