Thin film package structure, thin film package method, and display panel

US11374201B2 · kind B2 · utility

Assignee

• KunShan Go-Visionox Opto-Electronics Co., Ltd · CN

Inventors

• Quan Liu · Kunshan, CN
• Lu Zhang · Shanghai, CN
• Zhenzhen Han · Kunshan, CN
• Siming Hu · Kunshan, CN
• Hui Zhu · Shanghai, CN

Key dates

• Filing date: Apr 28, 2018
• Grant date: Jun 28, 2022
• Expiry date: Feb 22, 2040

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10K59/8722

Abstract

A thin film package structure, a thin film package method, and a display panel are disclosed. The thin film package structure includes a substrate, an organic adhesive layer, and a package film layer. The package film layer covers the substrate and the organic adhesive layer. The organic adhesive layer in the non-display region is designed to have a groove structure and an embankment structure defined by the groove structure. The groove structure and the embankment structure surround the display region. At least one of the groove structures and the embankment structure is a structure extending in a zigzag form or a grid-shaped structure. The organic adhesive layer is disposed in the non-display region of the substrate, and is designed to have multiple zigzagging or grid-shaped groove structures.