Patent · US Active

Filter arrangement

US11374297B2 · kind B2 · utility

0Cited by

5References

19Claims

0Family size

Assignee

Telefonaktiebolaget LM Ericsson (Publ) · SE

Inventors

Anatoli Deleniv · Mölndal, SE
Ola Tageman · Handen, SE

Key dates

Filing date	Oct 18, 2017
Grant date	Jun 28, 2022
Priority date	—
Expiry date	Nov 4, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH01Q21/005
WIPO fieldTelecommunications
WIPO sectorElectrical engineering

Abstract

A filter arrangement having three or more stacked metallization layers separated by printed circuit board, PCB, layers. Each metallization layer includes an aperture. The filter arrangement has a plurality of via-holes extending though the stacked metallization layers and through the separating Dielectric material layers, whereby the via-holes and the metallization layers delimit a cavity in each Dielectric material layer. The cavities in two consecutive Dielectric material layers being coupled by the aperture in the single metallization layer separating the two consecutive Dielectric material layers. The aperture of a topmost metallization layer being arranged as antenna element. The filter arrangement having a signal interface arranged as a conduit connecting at least one dielectric material layer to an exterior of the filter arrangement.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.