Encapsulation compositions
US11375714B2 · kind B2 · utility
0Cited by
5References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 8, 2017 |
| Grant date | Jul 5, 2022 |
| Priority date | — |
| Expiry date | Sep 14, 2037 |
Classification
- Technology area (CPC D)Textiles; Paper
- CPC primaryD06M23/12
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
An encapsulation composition is described. The composition comprises a plurality of capsules, each capsule comprising an amphiphilic material encapsulating a pyrethroid. The encapsulated pyrethroid has a release rate less than the release rate of the unencapsulated pyrethroid. Coated fabric products are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.