Ultrasound apparatuses and methods for fabricating ultrasound devices

US11375980B2 · kind B2 · utility

Assignee

• BFLY Operations, Inc. · US

Inventors

• Kailiang Chen · Branford, US
• Nevada J. Sanchez · Guilford, US
• Susan A. Alie · Stoneham, US
• Tyler S. Ralston · Clinton, US
• Jonathan M. Rothberg · Paradise, US
• Keith G. Fife · Palo Alto, US
• Joseph Lutsky · Los Altos, US

Key dates

• Filing date: May 6, 2019
• Grant date: Jul 5, 2022
• Expiry date: May 6, 2039

Classification

• Technology area (CPC H): Electricity
• CPC primary: H04B11/00
• WIPO field: Medical technology
• WIPO sector: Instruments

Abstract

Aspects of the technology described herein relate to an ultrasound device including a first die that includes an ultrasonic transducer, a first application-specific integrated circuit (ASIC) that is bonded to the first die and includes a pulser, and a second ASIC in communication with the second ASIC that includes integrated digital receive circuitry. In some embodiments, the first ASIC may be bonded to the second ASIC and the second ASIC may include analog processing circuitry and an analog-to-digital converter. In such embodiments, the second ASIC may include a through-silicon via (TSV) facilitating communication between the first ASIC and the second ASIC. In some embodiments, SERDES circuitry facilitates communication between the first ASIC and the second ASIC and the first ASIC includes analog processing circuitry and an analog-to-digital converter. In some embodiments, the technology node of the first ASIC is different from the technology node of the second ASIC.