Patent · US Active

Method of measuring true shear viscosity profile of molding material in capillary and molding system performing the same

US11376776B2 · kind B2 · utility

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1References
13Claims
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Key dates

Filing dateJul 21, 2021
Grant dateJul 5, 2022
Priority date
Expiry dateJul 21, 2041

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG05B2219/45244
  • WIPO fieldOther special machines
  • WIPO sectorMechanical engineering

Abstract

The present disclosure provides a method of measuring a true shear viscosity profile of a molding material in a capillary and a molding system performing the same. The method includes the operations of: determining a setpoint temperature of the molding material before injecting into the capillary; obtaining an initial shear viscosity profile at the setpoint temperature with respect to a shear rate of the molding material; fitting an initial temperature profile with respect to the shear rate according to the initial shear viscosity based on Cross William-Landel-Ferry model; fitting a first shear viscosity profile and a first temperature profile with respect to the shear rate according to the initial temperature profile based on the Cross-WLF model; and setting the first shear viscosity profile as the true shear viscosity profile when a difference between the first temperature profile and the initial temperature profile is not greater than a threshold.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.