Polyethylene film structures and related methods
US11376828B2 · kind B2 · utility
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18Claims
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Key dates
| Filing date | Oct 22, 2019 |
| Grant date | Jul 5, 2022 |
| Priority date | — |
| Expiry date | Mar 2, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K5/098
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Film structures and related methods and uses thereof are described herein. One or more of the film structures generally include an A layer, a B layer and a C layer. The B layer is positioned between the A layer and the C layer. The A layer includes high density polyethylene. The B layer includes linear low density polyethylene and a nucleating agent. The C layer includes one or more polymers. One or more of the related methods include methods for producing film structures including an A layer, a B layer, and a C layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.