Method for attaching a heat-emitting device, spacecraft wall and spacecraft
US11377236B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 18, 2019 |
| Grant date | Jul 5, 2022 |
| Priority date | — |
| Expiry date | Dec 18, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB64G1/506
- WIPO fieldTransport
- WIPO sectorMechanical engineering
Abstract
A method for attaching a heat-emitting device and a capillary heat pipe to a panel of a spacecraft wall is disclosed including the steps of: a) positioning a capillary heat pipe on a portion of the panel; attaching female attachment bodies to the panel, the female attachment bodies protruding relative to the capillary heat pipe; c) placing a thermally-conductive and self-curing paste over a portion of the capillary heat pipe or over a heat-emitting device; d) placing a heat-emitting device on the thermally-conductive and self-curing paste and on the female attachment bodies, said heat-emitting device bearing against and being in direct contact with the female attachment bodies, and e) attaching the heat-emitting device and said capillary heat pipe to the panel by attaching male attachment members to the female attachment bodies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.