Method for producing microstructures in a glass substrate
US11377387B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 23, 2020 |
| Grant date | Jul 5, 2022 |
| Priority date | — |
| Expiry date | Apr 23, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2201/0154
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for producing microstructures includes introducing modifications by a laser beam into a volume between two opposite outer surfaces of a glass substrate. An etching method is carried out which provides anisotropic material removal in one of the outer surfaces so as to produce recesses that have a conical shape. A layer that is resistant to an etching effect of the etching method is applied as a cover layer to only one outer surface. Then, a further etching method is carried out so that material is removed in the other outer surface until recesses of this other outer surface, which are produced and/or enlarged by the further etching method, have reached the cover layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.