Toughened adhesive and bonding method using the same
US11377530B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Dec 18, 2018 |
| Grant date | Jul 5, 2022 |
| Priority date | — |
| Expiry date | Mar 7, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2463/00
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A bonding method for joining two structural parts using a curable adhesive layer having a fibrous veil embedded therein. The fibrous veil carries a polymeric binder, which is in a solid phase at room temperature (20° C.-25° C.) and is capable of dissolving into the adhesive composition during curing thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.