Electrodeposition of high damping magnetic alloys
US11377749B1 · kind B1 · utility
2Cited by
16References
16Claims
0Family size
Assignee
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Key dates
| Filing date | Dec 6, 2019 |
| Grant date | Jul 5, 2022 |
| Priority date | — |
| Expiry date | Dec 6, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01F41/26
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method includes immersing a wafer in an electrolyte including a plurality of compounds having elements of a high damping magnetic alloy with very low impurity and small uniform grain size. The method also includes applying a pulsed current with a certain range of duty cycle and pulse length to the wafer when the wafer is immersed in an electrolyte. The wafer is removed from the electrolyte when a layer of the high damping magnetic alloy is formed on the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.