Polycrystalline diamond compact
US11377910B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 18, 2019 |
| Grant date | Jul 5, 2022 |
| Priority date | — |
| Expiry date | Oct 11, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC04B2237/64
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A polycrystalline diamond compact including a cemented carbide substrate and a polycrystalline diamond layer bonded to the cemented carbide substrate. The polycrystalline diamond layer is nonplanar and includes a central part and a peripheral part surrounding the central part. The central part includes a protruding surface relative to the peripheral part. The protruding surface is spherical or planar. The peripheral part includes a plurality of radially-disposed ridges.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.