Techniques for compact optical sensing module with hybrid multi-chip integration
US11378664B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 5, 2021 |
| Grant date | Jul 5, 2022 |
| Priority date | — |
| Expiry date | Oct 5, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A light detection and ranging (LIDAR) system and apparatus including a photonics chip coupled to a substrate, the photonics chip including an optical source to generate an optical beam, a waveguide to direct the optical beam through the photonics chip, a photodetector to generate an electrical signal in response to detecting a return signal, and an optical coupler to transmit the optical beam from the waveguide to a target in the field of view of the LIDAR apparatus. The system and apparatus may further include an integrated circuit (IC) chip coupled to the photonics chip, the IC chip to process the electrical signal generated by the photodetector.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.