Touch module
US11379085B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 2, 2020 |
| Grant date | Jul 5, 2022 |
| Priority date | — |
| Expiry date | Nov 2, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2203/04111
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
The present disclosure relates to the field of touch technology, and provides a touch module, which includes a substrate, a first bridging layer, a first touch sensing layer, a second bridging layer, and a second touch sensing layer. The first bridging layer extends on the substrate along a first direction. The first touch sensing layer is disposed on the substrate and includes a plurality of first touch sensing electrodes, wherein the first bridging layer connects adjacent first touch sensing electrodes of the first touch sensing electrodes. The second bridging layer is disposed on the first bridging layer, located between the adjacent first touch sensing electrodes, and connected in parallel with the first bridging layer. The second touch sensing layer is disposed on the substrate, crosses the second bridging layer along a second direction, and is disposed between the adjacent first touch sensing electrodes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.