Plasma processing apparatus
US11380528B2 · kind B2 · utility
0Cited by
3References
16Claims
0Family size
Inventors
Key dates
| Filing date | Jun 13, 2018 |
| Grant date | Jul 5, 2022 |
| Priority date | — |
| Expiry date | Aug 25, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32082
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A plasma processing apparatus for processing a substrate using a plasma, comprising: a process chamber in which the processing takes place; a plasma source for providing a plasma to the process chamber; a substrate mount within the process chamber for holding the substrate, the substrate mount comprising a surface having a plurality of apertures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.