Methods of forming electronic assemblies with textured surfaces using low current density electroplating
US11380604B2 · kind B2 · utility
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12Claims
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Key dates
| Filing date | Nov 26, 2019 |
| Grant date | Jul 5, 2022 |
| Priority date | — |
| Expiry date | Oct 15, 2040 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28D2021/0029
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A method of forming a textured surface layer along a substrate that includes disposing a plurality of polymer spheres on a surface of the metal substrate, and electroplating the metal substrate at a current density to deposit a metal layer along a body of each of the plurality of polymer spheres disposed on the surface of the metal substrate. The metal layer does not extend above a top surface of the plurality of polymer spheres. The method further includes removing the plurality of polymer spheres from the metal layer to form the textured surface defined by a size and shape of the plurality of polymer spheres.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.