Circuit assembly
US11380614B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 2, 2020 |
| Grant date | Jul 5, 2022 |
| Priority date | — |
| Expiry date | Oct 24, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/9202
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A circuit assembly includes an integrated circuit (IC) die and a first capacitor die. The IC die provides an IC and includes a plurality of first conductive pads. The first capacitor die provides a plurality of capacitors, and includes a plurality of second conductive pads at the first side and a plurality of conductive vias at the second side. At least one of the second conductive pads electrically connects to the capacitors. The conductive vias is adapted to form a plurality of external signal connections of the IC die and the first capacitor die. The IC die is stacked with the first capacitor die in such a way that the first conductive pads electrically connect to the second conductive pads, and surfaces of the IC die and the first capacitor die attaching to each other are substantially of the same size.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.