Shield to protect vias from electromagnetic interference
US11380623B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 28, 2018 |
| Grant date | Jul 5, 2022 |
| Priority date | — |
| Expiry date | Oct 7, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0251
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Embodiments herein relate to a package having a substrate with a core layer with a plurality of conductors coupling a first side of the core layer with a second side of the core layer, and a shield within the core layer that separates a first conductor of the plurality of conductors from a second conductor of the plurality of conductors where the shield is to reduce electromagnetic interference received by the second conductor that is generated by the first conductor. Embodiments may also be related to a package having a substrate with a through hole via through the substrate, where an EMI protective material is applied to a surface of the substrate that forms the via to shield an inner portion of the via.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.