Radio frequency module
US11380633B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 13, 2020 |
| Grant date | Jul 5, 2022 |
| Priority date | — |
| Expiry date | Jan 20, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A radio frequency module includes a radio frequency integrated circuit (RFIC) to input or output a base signal and a radio frequency (RF) signal having a higher frequency than the base signal, a wiring via extending upward from the RFIC and a feed line electrically connected to the wiring via to provide a transmission path of the RF signal, a second ground layer surrounding the feed line, a first ground layer spaced above the second ground layer, a third ground layer between the second ground layer and the RFIC, a feed-line insulating layer disposed between the first and third ground layers, an IC wiring layer between the third ground layer and the RFIC, electrically connected to the RFIC, and providing a transmission path of the base signal, and an IC insulating layer between the third ground layer and the RFIC, having a higher dielectric constant than the feed-line insulating layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.