Patent · US Active

Dicing method for separating wafers comprising a plurality of solar cell stacks

US11380814B2 · kind B2 · utility

0Cited by

7References

12Claims

0Family size

Assignee

Azur Space Solar Power GmbH · DE

Inventors

Steffen SOMMER · Tamm, DE
Wolfgang KOESTLER · Heilbronn, DE
Alexander Frey · Lappersdorf, DE

Key dates

Filing date	Aug 31, 2020
Grant date	Jul 5, 2022
Priority date	—
Expiry date	Jan 27, 2041

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB23K2103/56
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A dicing method for separating a wafer comprising a plurality of solar cells stack along at least one parting line, at least having the steps of: providing the wafer with a top, a bottom, an adhesive layer which is integrally bonded with the top and a cover glass layer which is integrally bonded with the adhesive layer, wherein the wafer includes a plurality of solar cell stacks, each having a germanium substrate layer forming the bottom of the wafer, a germanium sub-cell and at least two III-V sub-cells; creating a separating trench along the parting line by means of laser ablation, which extends from a bottom of the wafer through the wafer and the adhesive layer at least up to a top of the cover glass layer; and dividing the cover glass layer along the separating trench.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.