Patent · US Active

Multi-stack cooling structure for radiofrequency component

US11382206B2 · kind B2 · utility

0Cited by

1References

15Claims

0Family size

Assignee

COMET AG · DE

Inventors

Andre Grede · Glückstadt, DE
Daniel Gruner · Müllheim, DE
Anton Labanc · Ehrenkirchen, DE

Key dates

Filing date	Aug 20, 2018
Grant date	Jul 5, 2022
Priority date	—
Expiry date	Aug 20, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/10416
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

An apparatus which includes: a circuit board having a radiofrequency (RF) structure at a first location thereof, the RF structure formed from a conductive trace of the circuit board; a heat carrier; and a multi-stack cooling structure coupling the circuit board and the heat carrier to each other. The multi-stack cooling structure including a first stack adjacent the RF structure at the first location and a second stack at a second location. The first stack including a dielectric layer adjacent the heat carrier, and a thermal interface material (TIM) that couples the dielectric layer and the circuit board to each other, the dielectric layer having higher thermal conductivity and higher rigidity than the TIM. The second stack including a metal layer adjacent the heat carrier, and the TIM that couples the metal layer and the circuit board to each other.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.