Printed wiring board and method for manufacturing the same
US11382218B2 · kind B2 · utility
0Cited by
8References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 24, 2019 |
| Grant date | Jul 5, 2022 |
| Priority date | — |
| Expiry date | May 24, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1189
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In a printed wiring board, when a plurality of wiring base bodies are collectively stacked, a constituent material of a first layer of an insulating resin film has a low melting point, so that the first layer is easily melted. Therefore, thermal welding on an upper surface of the wiring base body is reliably performed, and the wiring base bodies are bonded to each other with high reliability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.