Spring and damper system and method for producing same
US11382223B2 · kind B2 · utility
1Cited by
20References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2015 |
| Grant date | Jul 5, 2022 |
| Priority date | — |
| Expiry date | Jan 29, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02T90/14
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A spring and damper system for a circuit board includes a spring arrangement having a plurality of compression springs. Each of the compression springs has a contact portion and two ends which are disposed away from their respective contact portion. Each of a plurality of dampers is disposed on a respective one of the ends of the compression springs and configured to contact a portion of the circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.