Lead-free solder composition
US11383330B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 21, 2020 |
| Grant date | Jul 12, 2022 |
| Priority date | — |
| Expiry date | Sep 21, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12722
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An electrical connector includes a first layer having a first coefficient of thermal expansion and a second layer overlaying the first layer having a second coefficient of thermal expansion. A first difference between the first coefficient of thermal expansion and a coefficient of thermal expansion of glass is greater than a second difference between the second coefficient of thermal expansion and the coefficient of thermal expansion of glass. The electrical connector further includes a layer of a solder alloy having about 15% to 28% indium by weight, about 5% to 20% zinc by weight, about 1% to 6% silver by weight, and at least 36% tin by weight. The solder layer is disposed on at least a portion of the second layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.