Element substrate, liquid discharge head, and printing apparatus
US11383515B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 15, 2020 |
| Grant date | Jul 12, 2022 |
| Priority date | — |
| Expiry date | Apr 15, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2202/18
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
An element substrate comprises: a first insulation layer between a heater layer where plural heaters are formed, and a first wiring layer; and a second wiring layer formed within the first insulation layer, where an individual wiring connected to each heater is formed; a first metal plug that fills an interior of a first through-hole penetrating from the heater layer to the second wiring layer; and a second metal plug, provided in a place different from a place where the first through-hole is formed, that fills an interior of a second through-hole penetrating from the second wiring layer to the first wiring layer. Each heater is connected to the second wiring layer via the first metal plug, and the second wiring layer is connected to the first wiring layer via the second metal plug.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.