Sensor device and method of fabrication
US11383973B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 22, 2020 |
| Grant date | Jul 12, 2022 |
| Priority date | — |
| Expiry date | Aug 29, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2201/0132
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A device includes a substrate, a first electrode formed on the substrate and a structural layer formed on the substrate. The structural layer includes a movable mass and a fixed portion, the movable mass being suspended above the substrate and the first electrode being interposed between the substrate and the movable mass. A second electrode is spaced apart from an upper surface of the movable mass by a gap and an anchor couples the second electrode to the fixed portion of the structural layer. A method entails integrating formation of the second electrode into a wafer process flow in which the first electrode and the structural layer are formed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.