Difunctional biphenyl compounds, preparation, and uses
US11384195B2 · kind B2 · utility
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Key dates
| Filing date | Feb 7, 2019 |
| Grant date | Jul 12, 2022 |
| Priority date | — |
| Expiry date | Jun 2, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G59/50
- WIPO fieldOrganic fine chemistry
- WIPO sectorChemistry
Abstract
A difunctional biphenyl compounds corresponding to formula (I) wherein Alk, Alk′ and R are as defined in the description. These compounds are suitable as hardeners for thermosetting resins, especially epoxy resins.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.