Etchant composition and forming method of wiring using etchant composition
US11384437B2 · kind B2 · utility
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19Claims
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Key dates
| Filing date | Apr 21, 2020 |
| Grant date | Jul 12, 2022 |
| Priority date | — |
| Expiry date | Apr 21, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D30/6755
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A phosphoric acid-free etchant composition and a method of forming a wiring, the composition including about 40 wt % to about 60 wt % of an organic acid compound; about 6 wt % to about 12 wt % of a glycol compound; about 1 wt % to about 10 wt % of nitric acid, sulfuric acid, or hydrochloric acid; about 1 wt % to about 10 wt % of a nitrate salt compound; and water, all wt % being based on a total weight of the phosphoric acid-free etchant composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.