Pressure sensor with external vertical electrical interconnection system
US11385118B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 25, 2019 |
| Grant date | Jul 12, 2022 |
| Priority date | — |
| Expiry date | Sep 15, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K5/068
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A pressure sensor assembly, which includes a support substrate, circuitry mounted to the support substrate, at least one conductor mounted to the support substrate and in electrical communication with the circuitry, and at least one vertically conductive path connected to and in electrical communication with the at least one conductor. The pressure sensor assembly also includes a diaphragm, at least one sealing glass section connected to the diaphragm and the support substrate, and at least one lateral conductive feed-through mounted to the diaphragm. At least one conductive joint is connected to the vertically conductive path and the lateral conductive feed-through, and the conductive joint provides electrical communication between the vertically conductive path and the lateral conductive feed-through.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.