Migrating logical volumes from a thick provisioned layout to a thin provisioned layout
US11385947B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 24, 2020 |
| Grant date | Jul 12, 2022 |
| Priority date | — |
| Expiry date | Nov 24, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F9/542
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
The present disclosure is directed to migrating logical volumes from a thick provisioned layout to a thin provisioned layout, and includes one or more processors and one or more computer-readable non-transitory storage media comprising instructions that, when executed by the one or more processors, cause one or more components of the system to perform operations comprising creating an abstraction layer on top of a logical volume in a storage device, the abstraction layer for accessing the logical volume, the logical volume one of a plurality of logical volumes in a volume group of the storage device; allocating a thin pool from remaining storage space in the volume group of the storage device; creating a snapshot of the logical volume; adding a thin virtual volume corresponding to the logical volume to the thin pool; and copying data from the snapshot to the thin virtual volume.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.