Electronic chip
US11387195B2 · kind B2 · utility
0Cited by
2References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 22, 2020 |
| Grant date | Jul 12, 2022 |
| Priority date | — |
| Expiry date | Jan 5, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/576
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic chip includes a substrate made of semiconductor material. Conductive pads are located on a front side of the substrate and cavities extend into the substrate from a backside of the substrate. Each cavity reaches an associated conductive pad. Protrusions are disposed on the backside of the substrate. A conductive layer covers the walls and bottoms of the cavities. The conductive layer includes portions on the backside, each portion partially located on an associated protrusion and electrically connecting two of the conductive pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.