Nonvolatile memory device and method for fabricating the same
US11387249B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 10, 2019 |
| Grant date | Jul 12, 2022 |
| Priority date | — |
| Expiry date | Feb 29, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A three-dimensional nonvolatile memory device and a method for fabricating the same include a semiconductor substrate, a plurality of active pillars, a plurality of gate electrodes, and a plurality of supporters. The semiconductor substrate includes a memory cell region and a contact region. The active pillars extend in the memory cell region perpendicularly to the semiconductor substrate. The gate electrodes intersect the active pillars, extend from the memory cell region to the contact region and are stacked on the semiconductor substrate. The supporters extend in the contact region perpendicularly to the semiconductor substrate to penetrate at least one or more of the gate electrodes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.