Thermal active heat sink
US11388812B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 22, 2020 |
| Grant date | Jul 12, 2022 |
| Priority date | — |
| Expiry date | Dec 22, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/066
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic controller is provided and includes a printed wiring board (PWB) on which electronics are operably disposed, a power supply configured to supply power to the electronics, a heat sink and one or more thermal conductors anchored to the PWB to assume and move between first and second connection states in first and second thermal conditions, respectively. The first connection states are characterized in that the one or more thermal conductors are thermally attached to the PWB and the power supply and thermally disconnected from the heat sink. The second connection states are characterized in that the one or more thermal conductors are thermally attached to the PWB and the power supply and to the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.